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G08600 - SEMI G86 - シリコンチップ(ダイ)の三点曲げテスト方法 StdPbc-0212 1 — Specification for SECS-I

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Description

1 — Specification for SECS-I and SECS-II Protocol for Carrier ID Reader/Writer Functional Standard

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SEMI F63-0918 (technical revision)

G08600 - SEMI G86 - シリコンチップ(ダイ)の三点曲げテスト方法 StdPbc-0212 1 — Specification for SECS-IGlobal Assembly and Packaging CommitteeJapanese Packaging Committee2003 110Japanese Regional Standards Committee20031 www. semi. org20033 Referenced SEMI Standards None.

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